An alternative solution for semi-automated high-quality TEM lamella preparation

• Low-kV ultra-high-resolution imaging of high-end semiconductor devices

• Precise end-pointing at low electron beam energies

• Gentle FIB thinning for improved quality results in TEM sample preparation enabled by excellent low-kV ion beam performance

• Optimized workflows and recipes for easy preparation of ultra-thin TEM lamellae

• Semi-automated software module for site-specific TEM lamella preparation

• Preparation of advanced geometry TEM lamellae from the most advanced semiconductor nodes

• Specialized, load-lock-compatible stage carousel for TEM sample preparation

• Dedicated TEM grid holders with fully optimized geometry for advanced TEM sample preparation